Radio-frequency integrated circuit (RFIC) chip(s) for providing distributed antenna system functionalities, and related components, systems, and methods

ABSTRACT

Radio-frequency (RF) integrated circuit (RFIC) chip(s) allow for the integration of multiple electronic circuits on a chip to provide distributed antenna system functionalities. RFIC chips are employed in central unit and remote unit components, reducing component cost and size, increasing performance and reliability, while reducing power consumption. The components are also easier to manufacture. The RFIC chip(s) can be employed in distributed antenna systems and components that support RF communications services and/or digital data services.

PRIORITY APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/283,952, filed Oct. 3, 2016, which is a continuation of U.S. patentapplication Ser. No. 15/137,389, filed Apr. 25, 2016, now U.S. Pat. No.9,485,803, which is a continuation of U.S. patent application Ser. No.14/486,387, filed Sep. 15, 2014, now U.S. Pat. No. 9,338,823, which is acontinuation of International App. No. PCT/US13/33253, filed Mar. 21,2013, which claims the benefit of priority to U.S. Provisional App. No.61/614,831, filed Mar. 23, 2012, the contents of which are relied uponand incorporated herein by reference in their entireties.

BACKGROUND Field of the Disclosure

The technology of the disclosure relates to distributed antenna systemsconfigured to provide communications signals over a communicationsmedium to and from one or more remote access units for communicatingwith client devices.

Technical Background

Wireless communication is rapidly growing, with ever-increasing demandsfor high-speed mobile data communication. As an example, local areawireless services (e.g., “wireless fidelity” or “WiFi” systems) and widearea wireless services are being deployed in many different types ofareas. Distributed communications or antenna systems communicate withwireless devices called “clients,” “client devices,” or “wireless clientdevices,” within the wireless range or “cell coverage area” in order tocommunicate with an access point device. Distributed antenna systems areparticularly useful to be deployed inside buildings or other indoorenvironments where client devices may not otherwise be able toeffectively receive radio-frequency (RF) signals from sources such asbase stations. Applications where distributed antenna systems canprovide wireless services include public safety, cellular telephony,wireless LANs, location tracking, and medical telemetry inside buildingsand over campuses.

One approach to deploying a distributed antenna system involves the useof RF antenna coverage areas, also referred to as “antenna coverageareas.” Antenna coverage areas can be formed by remotely distributedantenna units, also referred to as remote units (RUs). The RUs operateone or more antennas configured to support the desired frequency(ies) orpolarization to provide the antenna coverage areas. Typical antennacoverage areas can have a radius in the range from a few meters to up totwenty meters. Combining a number of RUs creates an array of antennacoverage areas. Because the antenna coverage areas each cover smallareas, there typically may be only a few users (clients) per antennacoverage area. This arrangement generates a uniform high quality signalenabling high throughput for the wireless system users.

Distributed antenna systems can be configured to serve a single wirelessservice or a combination of many wireless services operating overmultiple radio bands. Different communications mediums can be employedfor distributing RF signals to the RUs, such as electrical conductors(e.g., twisted pair wires, coaxial cables), optical fibers, and wirelesstransmissions. Distributed antenna systems can be employed in existingdistributed communications systems where wireless signals aredistributed over the same cabling as provided between a hub and accesspoints (APs) in the distributed wireless communications systems.

As the wireless industry evolves, distributed antenna systems havebecome more sophisticated. Distributed antenna systems may require morecomplex electronic circuits to enable better use of limited bandwidthsand to provide additional functionality. For example, electroniccircuits may be employed for additional functionalities, such asinterference reduction, increased output power, handling high dynamicrange, and signal noise reduction. Further, the functionality of aremote unit may be included in an AP in a distributed wirelesscommunications system. It may be desired to provide remote unitfunctionality in APs in a distributed wireless communications systemwithout changing or enlarging the form factor of the APs.

SUMMARY OF THE DETAILED DESCRIPTION

Embodiments disclosed herein include radio-frequency (RF) integratedcircuit (IC) (RFIC) chip(s) for providing distributed antenna systemfunctionalities. Related distributed antenna components, systems, andmethods are also disclosed. Providing distributed antenna systemfunctionalities in RFIC chips can allow integration of multipleelectronic circuits that provide multiple functionalities in a singleRFIC chip or reduced RFIC chip set. Cost reductions, size reduction,increase performance, increased reliability, reduction in powerconsumption, and improved manufacturability in distributed antennasystem electronic circuits and components are non-limiting examples ofadvantages that may be realized by providing RFICs in distributedantenna system components. As an example, the RFIC chip(s) can beemployed in a central unit that receives communication signals ofcommunications services for providing to remote units (RUs). As anotherexample, the RFIC chip(s) can be employed in the remote units thatprovide received communications signals from the central unit to clientdevices. As another example, the RFIC chip(s) can be employed indistributed antenna systems and components that support RFcommunications services and/or digital data services.

In one embodiment, a central unit for providing communications signalsin a distributed antenna system comprises a RF communications interface.The RF communications interface is configured to receive downlink RFcommunication signals at a RF communications frequency for a RFcommunications service, and to provide uplink RF communication signalsat the RF communications frequency for the RF communications service.The central unit also comprises at least one RFIC chip comprising atleast one of a first frequency conversion circuitry configured to shifta frequency of the downlink RF communication signals to an IF having adifferent frequency than the RF communications frequency (e.g., lower orhigher), to provide downlink IF communications signals, and a secondfrequency conversion circuitry configured to shift the frequency ofuplink IF communication signals to the RF communications frequency toprovide the uplink RF communications signals.

In another embodiment, a method for providing communications signals ina central unit comprises receiving downlink RF communication signals ata RF communications frequency for a RF communications service in acommunications interface. The method also comprises receiving uplink RFcommunication signals at the RF communications frequency for the RFcommunications service in the communications interface, shifting afrequency of the downlink RF communication signals to an intermediatefrequency (IF) having a different frequency than the RF communicationsfrequency, to provide downlink IF communications signals in a firstfrequency conversion circuitry, and shifting the frequency of uplink IFcommunication signals to the RF communications frequency to provide theuplink RF communications signals in a second frequency conversioncircuitry. The method also comprises at least one of the first frequencyconversion circuitry and the second frequency conversion circuitryprovided in at least one RFIC chip.

In another embodiment, a remote unit for providing receivedcommunications signals in a distributed antenna system comprises a RFcommunications interface. The RF communications interface is configuredto receive downlink IF communication signals at an IF for a RFcommunications service over a communications medium from a central unit.The RF communications interface is also configured to receive uplink RFcommunication signals at a RF communications frequency for the RFcommunications service. The RU further comprises at least one RFIC chipcomprising at least one of a first frequency conversion circuitryconfigured to shift a frequency of downlink IF communication signals toa RF communications frequency of RF communications service to radiatedownlink RF communications signals over a first antenna element, and asecond frequency conversion circuitry configured to shift the frequencyof uplink RF communication signals received from a second antennaelement to the IF to provide uplink IF communications signals.

In another embodiment, a method of providing received communicationssignals in a RU is provided. The method comprises receiving downlink IFcommunication signals at an IF for a RF communications service in a RFcommunications interface. The method also comprises receiving uplink RFcommunication signals at a RF communications frequency for the RFcommunications service in a RF communications interface, and shifting afrequency of downlink IF communication signals to the RF communicationsfrequency of the RF communications service in a first frequencyconversion circuitry provided in at least one RFIC chip, to radiatedownlink RF communications signals over a first antenna element. Themethod also comprises shifting the frequency of uplink RF communicationsignals received from a second antenna element to the IF in a secondfrequency conversion circuitry provided in the RFIC chip, to provideuplink IF communications signals.

In another embodiment, a distributed antenna system comprises one ormore remote units (RUs), and a central unit having a central unitradio-frequency (RF) communications interface. The central unit RFcommunications interface is configured to receive downlink RFcommunication signals at a RF communications frequency for a RFcommunications service, and to receive uplink RF communication signalsat the RF communications frequency for the RF communications service.The central unit also comprises a down conversion RFIC chip thatcomprises down conversion circuitry configured to shift the frequency ofthe downlink RF communication signals to an intermediate frequencyhaving a different (e.g., lower or higher) frequency than the RFcommunications frequency, to provide downlink IF communications signals.The central unit also comprises an up conversion RFIC chip having upconversion circuitry configured to shift the frequency of uplink IFcommunication signals to the RF communications frequency to provide theuplink RF communications signals. The central unit also comprises acentral unit communications interface comprising communicationscircuitry. The communications circuitry is configured to receive thedownlink IF communication signals and provide the downlink IFcommunications signals to one or RUs over a communications medium, andto receive the uplink IF communication signals from the one or more RUsover the communications medium and provide the uplink IF communicationsignals to the up conversion RFIC chip. The one or more RUs eachcomprise a RU communications interface configured to receive thedownlink IF communication signals from the central unit for the RFcommunications service. The RU communications interface is alsoconfigured to receive uplink RF communication signals at a RFcommunications frequency for the RF communications service. The one ormore RUs also each comprise an up conversion RFIC chip having upconversion circuitry configured to shift the frequency of downlink IFcommunication signals to the RF communications frequency to radiate thedownlink RF communications signals over a first antenna element. The oneor more RUs also each comprise a down conversion RFIC chip having downconversion circuitry configured to shift the frequency of uplink RFcommunication signals received from a second antenna element to the IFto provide the uplink IF communications signals.

The central units and RUs can support both RF communication services anddigital data services. These services can be wired or wirelesscommunications services that are typically communicated wirelessly, butmay be provided over non-wireless medium (e.g., electrical conductorand/or optical fiber). The RF communication services and digital dataservices can be provided over any type of communications medium,including electrical conductors and optical fiber to wireless clientdevices, such as remote units for example. Examples of digital dataservices include LAN using Ethernet, WLAN, WiMax, WiFi, DigitalSubscriber Line (DSL), telephony, WCDMA, and LTE, which can supportvoice and data. Digital data signals can be provided over separatecommunications media or a common medium for providing RF communicationservices.

Additional features and advantages will be set forth in the detaileddescription, and in part will be readily apparent to those skilled inthe art from that description or recognized by practicing theembodiments as described herein.

The accompanying drawings are included to provide a furtherunderstanding, and are incorporated into and constitute a part of thisspecification. The drawings illustrate various embodiments, and togetherwith the description serve to explain the principles and operation ofthe concepts disclosed.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic diagram of an exemplary single radio banddistributed radio-frequency (RF) antenna system employing RF integratedcircuit (RFIC) chips for providing RF communications services to remoteunits (RUs);

FIG. 2 is a schematic diagram of an exemplary distributed antenna systemthat includes the distributed RF communications system in FIG. 1 and adistributed wireless local access network (WLAN) system for providingdigital data services to WLAN access points (APs), wherein thedistributed WLAN and RF communications systems share a distributioncommunications media;

FIG. 3 is a schematic diagram of an RU that can be included in thesystem in FIG. 2, wherein the RU includes combined functionality of anAP and a RF antenna unit to support digital data services and RFcommunications services;

FIG. 4 is a schematic diagram of a dual radio band distributed RFcommunications system employing RFIC chips for providing RFcommunications services to RUs;

FIG. 5 is a schematic diagram of a single bandmultiple-input/multiple-output (MIMO) distributed RF communicationssystem employing RFIC chips;

FIGS. 6-8 are schematic diagrams of exemplary RFIC architectures thatcan be provided in a central unit supporting RF communications servicesto RUs;

FIGS. 9-14 are schematic diagrams of exemplary RFIC chip architecturesthat can be provided in a RU supporting RF communications services in adistributed antenna system;

FIG. 15 is a schematic diagram of another exemplary distributed antennasystem that includes a distributed WLAN system for providing digitaldata services and a distributed RF communications system employing aRFIC chip switching matrix for providing switched RF communicationsservices to RUs;

FIG. 16 is a schematic diagram of an intermediate frequency (IF)switching matrix employing a RFIC chip for providing switched RFcommunications services to RUs, and that may be provided as theswitching matrix in the system in FIG. 15;

FIG. 17 is a schematic diagram of an exemplary optical fiber-baseddistributed antenna system that can include RFIC chips to provide RFcommunications services; and

FIG. 18 is a schematic diagram of a generalized representation of acomputer system that can be included in or interface with any of theRFIC chips described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to the embodiments, examples ofwhich are illustrated in the accompanying drawings, in which some, butnot all embodiments are shown. Indeed, the concepts may be embodied inmany different forms and should not be construed as limiting herein;rather, these embodiments are provided so that this disclosure willsatisfy applicable legal requirements. Whenever possible, like referencenumbers will be used to refer to like components or parts.

Embodiments disclosed herein include radio-frequency (RF) integratedcircuit (RFIC) chip(s) for providing distributed antenna systemfunctionalities. Related distributed antenna elements, systems, andmethods are also disclosed. Providing distributed antenna systemfunctionalities in RFIC chips can allow integration of multipleelectronic circuits that provide multiple functionalities in a singleRFIC chip or reduced RFIC chip set. Cost reductions, size reduction,increased performance, increased reliability, reduction in power, andimproved manufacturability in distributed antenna system electroniccircuits and components are non-limiting examples of advantages that maybe realized by providing RFICs in distributed antenna system components.As one example, the RFIC chip(s) can be employed in a central unit thatreceives communication signals of communications services for providingto remote units (RUs). As another example, the RFIC chip(s) can beemployed in the RUs that provide received communications signals fromthe central unit to client devices. As another example, the RFIC chip(s)can be employed in distributed antenna systems and components thatsupport RF communications services and/or digital data services.

In this regard, FIG. 1 is a schematic diagram of an exemplary singleradio band distributed radio-frequency (RF) antenna system 10 employingRF integrated circuit (RFIC) chips for providing RF communicationsservices. The distributed antenna system 10 is configured to create oneor more antenna coverage areas for establishing communications withwireless client devices located in the RF range of the antenna coverageareas created by remote units (RUs) 12. The remote units 12 may also betermed “remote antenna units” if they contain one or more antennas tosupport wireless communications. The distributed antenna system 10provides any type of RF communication services desired, for examplecellular radio services as a non-limiting example. In this embodiment,the distributed antenna system 10 includes a central unit 14, one ormore RUs 12, and a communications medium 26 that communicatively couplesthe central unit 14 to the RU 12. The central unit is configured toprovide RF communication services to the RU 12 for wireless propagationto client devices in communication range of an antenna 16 of the RU 12.The RU 12 may also be configured to support wired communicationsservices. Note that although only one RU 12 is illustrated as beingcommunicatively coupled to the central unit in FIG. 1, a plurality ofRUs 12 can be communicatively coupled to the central unit 14 to receiveRF communication services from the central unit 14.

With continuing reference to FIG. 1, the central unit 14 includes aradio interface 18 (or RF interface) that is configured to receivedownlink RF communication signals 20D for RF communication services tobe provided to the RU 12. For example, the RF communications service maybe a cellular radio service, but could also be any other type of RFcommunications service. The radio interface 18 may receive the downlinkRF communications signals 20D to be provided to the RU 12 from a basetransceiver station (BTS) 22. As will be discussed in more detail below,the central unit 14 is configured to provide downlink RF communicationsignals 24D through a communications interface 27 to provide the RFcommunication services based on the downlink RF communications signals20D over a communications medium 26 to the RU 12. The communicationsinterface 27 could include a cable interface that interfaces with acable medium (e.g., coaxial cable, fiber optic cable) for sending andreceiving communications signals. The RU 12 includes a communicationsinterface 28 configured to receive the downlink RF communication signals24D and provide downlink RF communication signals 30D providing the RFcommunications services to an antenna interface 32. The antenna 16electrically coupled to the antenna interface 32 is configured towirelessly radiate the downlink RF communication signals 30D to wirelessclients in wireless communication range of the antenna 16. Thecommunications interface 28 could include a cable interface thatinterfaces with a cable medium (e.g., coaxial cable, fiber optic cable)for sending and receiving communications signals, including the downlinkRF communication signals 30D.

The downlink RF communication signals 24D, 30D may be the same signalsas the downlink RF communication signals 20D. Alternatively, as providedin the distributed antenna system 10 of FIG. 1, the downlink RFcommunications signals 20D are frequency shifted by down convertercircuitry (DC) 34 to provide downlink RF communications signals 24D. Thedownlink RF communications signals 20D are downconverted to the downlinkcommunications signals 24D to an intermediate frequency (IF) differentfrom (e.g., lower or higher than) the frequency of downlinkcommunications signals 20D. To recover the downlink RF communicationsignals 20D at the RU 12 to be radiated by the antenna 16, an upconverter circuitry (UC) 36 is provided in the RU 12 to up convert thedownlink RF communications signals 24D to the downlink RF communicationssignals 30D. The downlink RF communication signals 30D are of the sameor substantially the same frequency as the downlink RF communicationssignals 20D in this embodiment. The downlink RF communication signals30D may be frequency locked to the downlink RF communications signals20D, such as through employing a frequency correction circuit in the UC36. The downlink RF communication signals 30D may be phase locked to thedownlink RF communications signals 20D, such as through employing aphase locked loop (PLL) circuit in the UC 36 as another non-limitingexample.

With continuing reference to FIG. 1, the radio interface 18 is alsoconfigured to receive uplink RF communication signals 20U to provideuplink communications received at the RU 12 from wireless client devicesto the central unit 14. In this regard, the radio interface 18 receivesthe uplink RF communications signals 24U from the RU 12 via thecommunications interfaces 28, 27 in the RU 12 and central unit 14,respectively. The RU 12 is configured to provide the uplink RFcommunication signals 24U through the communications interface 28 toprovide uplink communications for the RF communication services over thecommunications medium 26 to the communications interface 27 of thecentral unit 14. The uplink RF communication signals 24D are based onthe uplink RF communication signals 30U received by the antenna 16 ofthe RU 12 from wireless client devices. The uplink RF communicationsignals 24U may be the same signals as the uplink RF communicationsignals 30U.

Alternatively, with continuing reference to FIG. 1, the downlink RFcommunications signals 24D are frequency shifted by down convertercircuitry (DC) 38 in the RU 12 to provide uplink RF communicationssignals 24U. The uplink RF communications signals 30U are downconvertedto the uplink communications signals 24U to an intermediate frequency(IF) that is different from the frequency of downlink communicationssignals 30U. To recover the uplink RF communication signals 30U at thecentral unit 14 to be provided to the BTS 22, an up converter circuitry(UC) 40 is provided in the central unit 14 to up convert the uplink RFcommunications signals 24U to the uplink RF communications signals 20U.The uplink RF communication signals 20U are of the same or substantiallythe same frequency as the uplink RF communications signals 30U in thisembodiment. The uplink RF communication signals 20U may be frequencylocked to the uplink RF communications signals 30U, such as throughemploying a frequency locked loop (FLL) circuit in the UC 40. The uplinkRF communication signals 20U is phase locked to the uplink RFcommunications signals 30U, such as through employing a phase lockedloop (PLL) circuit in the UC 40.

The communications medium 26 in the distributed antenna system 10 couldbe any number of mediums. For example, the communications medium may beelectrical conductors, such as twisted-pair wiring or coaxial cable.Frequency division multiplexing (FDM) or time division multiplexing(TDM) can be employed to provide RF communications signals between thecentral unit 14 and multiple RUs 12 communicatively coupled to thecentral unit 14 over the same communication medium 26. Alternatively,separate, dedicated communications medium 26 may be provided betweeneach RU 12 and the central unit 14. The UCs 36, 40, and DCs 38, 34 inthe RUs 12 and the central unit 14 could be provided to frequency shiftat different IFs to allow RF communications signals from multiple RUs 12to be provided over the same communications medium 26 withoutinterference in RF communications signals (e.g., if different codes orchannels not employed to separate signals for different users).

Also, for example, the communications medium 26 may have a lowerfrequency handling rating that the frequency of the RF communicationservice. In this regard, the down conversion of the downlink and uplinkRF communication signals 20D, 30U can frequency shift the signals to anIF that is within the frequency rating of the medium 26. Thecommunications medium 26 may have a lower bandwidth rating than thebandwidth requirements of the RF communications services. Thus, again,the down conversion of the downlink and uplink RF communication signals20D, 30U can frequency shift the signals to an IF that provides abandwidth range within the bandwidth range of the medium 26. Forexample, the distributed antenna system 10 may be configured to beemployed using an existing communications medium 26 for othercommunications services, such as digital data services (e.g., WLANservices). For example, the medium 26 may be CAT 5, CAT 6, or CAT 7conductor cable that is used for wired services such as Ethernet basedLAN as non-limiting examples. In this example, down conversion ensuresthat the downlink and uplink RF communications signals 24D, 24U can becommunicated with acceptable signal attenuation.

With continuing reference to FIG. 1, synthesizer circuits 42, 44 areprovided to provide RF reference signals for frequency conversion by theDCs 34, 38 and the UCs 40, 36 in the central unit 14 and the RU 12,respectively. The synthesizer circuitry 42 is provided in the centralunit 14. The synthesizer circuitry 44 is provided in the RU 12. Thesynthesizer circuit 42 in the central unit 14 provides one of more localoscillator (LO) signals 46 to the DC 34 for frequency shifting thedownlink RF communications signals 20D to the downlink RF communicationssignals 24D at a different, intermediate frequency (IF). The synthesizercircuit 42 also provides one of more RF reference signals 48 to the UC40 for frequency shifting the uplink RF communications signals 24U fromthe IF to the frequency of the RF communication services to provide theuplink RF communications signals 20U.

As a non-limiting example, the LO signals 46, 48 may be directlyprovided to mixers in the DC 34 and UC 40 to control generation ofmixing RF signals (not shown) to be mixed with the downlink RFcommunications signals 20D and the uplink RF communications signals 24U,respectively, for frequency shifting. As another non-limiting example,the LO signals 46, 48 may not be provided directly to mixers in the DC34 and UC 40. The LO signals 46, 48 may be provided to control othercircuitry that provides signals to control the mixers in the DC 34 andthe UC 40. The oscillators in the DC 34 and the UC 40 generate mixing RFsignals to be mixed with the downlink RF communications signals 20D andthe uplink RF communications signals 24U, respectively, for frequencyshifting.

The synthesizer circuit 44 in the RU 12 provides one or more LO 50 tothe DC 38 for frequency shifting the uplink RF communications signals30U to the uplink RF communications signals 24U at a different,intermediate frequency (IF). The synthesizer circuit 44 also providesone or more LO signals 52 to the UC 36 for frequency shifting thedownlink RF communications signals 24D from the IF to the frequency ofthe RF communications services to provide the uplink RF communicationsignals 30D. As an example, the LO signals 50, 52 may be directlyprovided to mixers in the DC 38 and UC 36 to control generation ofmixing RF signals (not shown) to be mixed with the downlink RFcommunications signals 24D and the uplink RF communications signals 30U,respectively, for frequency shifting. As another non-limiting example,the LO signals 50, 52 may not be provided directly to mixers in the DC38 and UC 36. The LO signals 50, 52 may be provided to control othercircuitry that provides signals to control the mixers in the DC 38 andthe UC 36. The oscillators in the synthesizer circuit 44 and the UC 36generate mixing RF signals to be mixed with the downlink RFcommunications signals 24D and the uplink RF communications signals 30U,respectively, for frequency shifting.

As will be discussed in more detail below, the distributed antennasystem 10 in FIG. 1 includes one or more RFIC chips for providing thedistributed antenna system functionalities, including thosefunctionalities discussed above. A RFIC chip is a specially designedintegrated circuit that includes desired groupings of circuits orcomponents described herein for realizing specific functionalities. Byproviding RFIC chips, part count and/or board area (or density) forcircuits or components described herein may be reduced. As anon-limiting example, a RFIC chip may enable all electronic circuits forthe central unit 14 or a RU 12 to be provided with less than seventypercent (70%) of cost, fifteen integrated circuits, and/or four hundred(400) passive components, as compared to designs that do not employ RFICchips. As another example, RFIC chips can enable electronic circuits tobe provided in a square area of less than 100 cm².

Providing distributed antenna system 10 functionalities in RFIC chipscan allow integration of multiple electronic circuits that providemultiple functionalities in a single RFIC chip or reduced RFIC chip set.Cost reductions, size reduction, increased performance, increasedreliability, and improved manufacturability in electronic circuits arenon-limiting examples of advantages that may be realized through use ofRFICs in the distributed antenna system 10 components.

With continuing reference to the distributed antenna system 10 in FIG.1, the radio interface 18 in the central unit 14 contains radiointerface circuitry that can be included in a radio interface RFIC chip54. The UC 40 in the central unit 14 contains up conversion circuitrythat can be included in an up conversion RFIC chip 56. The DC 34 in thecentral unit 14 contains down conversion circuitry that can be includedin a down conversion RFIC chip 58. The synthesizer circuitry 42 in thecentral unit 14 can be included in a synthesizer RFIC chip 60. Thecommunications interface 27 in the central unit 14 containscommunications interface circuitry that can be included in acommunications interface RFIC chip 62. Alternatively, the radiointerface 18, the UC 40, the DC 40, the synthesizer circuitry 42, andthe communications interface 27, or any combination or subset thereof,could be included in a single central unit RFIC chip 64.

With continuing reference to FIG. 1, the antenna interface 32 in the RU12 contains antenna interface circuitry that can be included in anantenna interface RFIC chip 66. The DC 38 in the RU 12 contains downconversion circuitry that can be included in a down conversion RFIC chip68. The UC 36 in the RU 12 contains up conversion circuitry that can beincluded in an up conversion RFIC chip 70. The synthesizer circuitry 44in the RU 12 can be included in a synthesizer RFIC chip 72. Thecommunications interface 28 in the RU 12 contains communicationsinterface circuitry that can be included in a communications interfaceRFIC chip 74. Alternatively, the antenna interface 32, the UC 36, the DC38, the synthesizer circuitry 44, and the communications interface 28,or any combination or subset of the foregoing, could be included in asingle RU RFIC chip 76.

The central unit 14 may be configured to support any frequenciesdesired, including but not limited to US FCC and Industry Canadafrequencies (824-849 MHz on uplink and 869-894 MHz on downlink), US FCCand Industry Canada frequencies (1850-1915 MHz on uplink and 1930-1995MHz on downlink), US FCC and Industry Canada frequencies (1710-1755 MHzon uplink and 2110-2155 MHz on downlink), US FCC frequencies (698-716MHz and 776-787 MHz on uplink and 728-746 MHz on downlink), EU R & TTEfrequencies (880-915 MHz on uplink and 925-960 MHz on downlink), EU R &TTE frequencies (1710-1785 MHz on uplink and 1805-1880 MHz on downlink),EU R & TTE frequencies (1920-1980 MHz on uplink and 2110-2170 MHz ondownlink), US FCC frequencies (806-824 MHz on uplink and 851-869 MHz ondownlink), US FCC frequencies (896-901 MHz on uplink and 929-941 MHz ondownlink), US FCC frequencies (793-805 MHz on uplink and 763-775 MHz ondownlink), and US FCC frequencies (2495-2690 MHz on uplink anddownlink), medical telemetry frequencies, and WLAN frequencies. Thecentral unit 14 may support frequency division duplexing (FDD) and timedivisional duplexing (TDD).

In another embodiment, an exemplary RU 12 may be configured to supportup to four (4) different radio bands/carriers (e.g. ATT, VZW, T-Mobile,Metro PCS: 700LTE/850/1900/2100). Radio band upgrades can be supportedby adding remote expansion units over the same communications media (orupgrade to MIMO on any single band). The RUs 12 and/or remote expansionunits may be configured to provide external filter interface to mitigatepotential strong interference at 700 MHz band (Public Safety, CH51,56);Single Antenna Port (N-type) provides DL output power per band (Lowbands (<1 GHz): 14 dBm, High bands (>1 GHz): 15 dBm); and satisfies theUL System RF spec (UL Noise Figure: 12 dB, UL IIP3: −5 dBm, UL AGC: 25dB range).

It may be desirable to provide both digital data services and RFcommunications services for wireless client devices in a distributedantenna system that employs an automatic antenna selection arrangement.Examples of digital data services include, but are not limited to,Ethemet, WLAN, WiMax, WiFi, Digital Subscriber Line (DSL), and LTE, etc.Ethemet standards could be supported, including but not limited to 100Megabits per second (Mbs) (i.e., fast Ethemet) or Gigabit (Gb) Ethemet,or ten Gigabit (10 G) Ethernet. Examples of digital data devicesinclude, but are not limited to, wired and wireless servers, wirelessaccess points (WAPs), gateways, desktop computers, hubs, switches,remote radio heads (RRHs), baseband units (BBUs), and femtocells. Aseparate digital data services network can be provided to providedigital data services to digital data devices.

In this regard, FIG. 2 is a schematic diagram of an exemplarydistributed antenna system 80 that includes the distributed RFcommunications system 10 in FIG. 1 and a wireless local access network(WLAN) system 82 for providing digital data services. The distributedantenna system 10 includes the central unit 14 described above withregard to FIG. 1. The central unit 14 is configured to receive thedownlink electrical communications signals 20D through downlinkinterfaces 84D from one or more base stations 86(1)-86(N), wherein N canbe any number. The central unit 14 can be configured receive RFcommunications services from multiple base stations 86(1)-86(N) tosupport multiple RF radio bands in the system 10. The central unit 14 isalso configured to provide the downlink RF communication signals 24D tothe RUs 12(1)-12(N and receive the uplink RF communications signals 24Ufrom RUs 12(1)-12(N) over the communications medium 26. M number of RUs12 signifies that any number, M number, of RUs 12 can be communicativelycoupled to the central unit 14.

With continuing reference to FIG. 2, a digital data switch 90 may alsobe provided in the WLAN system 82 for providing digital data signals,such as for WLAN services for example, to RUs 92(1)-92(P) configured tosupport digital data services, wherein P signifies that any number ofthe RUs 92 may be provided and supported by the WLAN system 82. Thedigital data switch 90 may be coupled to a network 94, such as theInternet. Downlink digital data signals 96D from the network 94 can beprovided to the digital data switch 90. The downlink digital datasignals 96D can be then provided to the RUs 92(1)-92(P) through slavecentral units 98(1)-98(Q), wherein Q can be any number desired. Thedigital data switch 90 can also receive uplink digital data signals 96Ufrom the RUs 92(1)-92(P) to be provided back to the network 94. Theslave central units 98(1)-98(Q) also receive the downlink RFcommunications signals 24D and provide uplink RF communications signals24U from the RUs 92(1)-92(P) to the central unit 14 in this embodiment.In this regard, the RUs 92(1)-92(P), by being communicatively coupled toa slave central unit 98(1) that supports both the RF communicationsservices and the digital data services, is included in both thedistributed antenna system 10 and the WLAN system 82 to support RFcommunication services and digital data services, respectively, withclient devices 100(1)-100(P). For example, such RU 92 may be configuredto communicate wirelessly with the WLAN user equipment (e.g., a laptop)and Wide Area Wireless service user equipment (e.g., a cellular phone).

FIG. 3 is a schematic diagram of the RU 92 in FIG. 2 that can supportboth RF communications services and digital data services. Asillustrated in FIG. 3, the RU 92 includes a digital data services AP 102(hereinafter “AP 102”), which may be an AP, and the RU 12 previouslydescribed in regard to FIG. 1. In this manner, the RU 92 includes thecircuitry to support both digital data services via the AP 102 and RFcommunication services via the RU 12. For example, the AP 102 may be aWLAN digital data service module or board. The AP 102 may be an AP thatis commonly available. By providing the RFIC chip(s) in the RU 12, theRU 12 can be provided in a reduced size and form factor that may allowthe RU 12 to be provided in an existing form factor of the AP 102 and ina cost effective manner.

FIG. 4 is a schematic diagram of an exemplary dual radio banddistributed RF antenna system 10′ employing RF integrated circuit (RFIC)chips for providing RF communications services to RUs 12′. Thedistributed antenna system 10′ employs a central unit 14′communicatively coupled to one or more RUs 12′ that can provide multipleradio bands. Only two radio bands are illustrated in FIG. 4 as beingprovided in the distributed antenna system 10′, however, the system 10′and its components could be configured to provide any number of radiobands, as desired. Common element numbers between components in thedistributed antenna system 10′ in FIG. 4 and the distributed antennasystem 10 in FIG. 1 denote common elements and functionality, and thuswill not be re-described. The notations (1) and (2) signify commonelements, but two of the elements provided, each for supporting a radioband among the two supported radio bands. Other combinations of radiobands may also be created using the RFIC chip(s) (e.g., triple band,quadro band etc.).

With continuing reference to FIG. 4, because the distributed antennasystem 10′ in FIG. 4 is shown as supporting two radio bands, the centralunit 14′ is configured to receive downlink RF communications signals20D(1), 20D(2) from two BTSs 22(1), 22(2) and receive uplink RFcommunications signals 24U(1), 24U(2) from the RU 12′. The radiointerface 18′ is configured to provide the downlink RF communicationssignals 20D(1), 20D(2) to two dedicated circuitries, one for each radioband. UC 40(1), synthesizer circuitry 42(1), and DC 34(1) are providedto support the first radio band. UC 40(2), synthesizer circuitry 42(2),and DC 34(2) are provided to support the second radio band. Similarly,the RU 12′ is configured to receive downlink RF communications signals24D(1), 24D(2) from the central unit 14′, and receive uplink RFcommunications signals 30U(1), 30U(2) for distribution to the centralunit 14′. The communications interface 28′ is configured to provide thedownlink RF communications signals 24D(1), 24D(2) to two dedicatedcircuitries, one for each radio band. UC 36(1), synthesizer circuitry44(1), and DC 38(1) are provided to support the first radio band. UC36(2), synthesizer circuitry 44(2), and DC 38(2) are provided to supportthe second radio band.

With continuing reference to FIG. 4, first and second antennas 16(1),16(2) are coupled to antenna interfaces 32(1), 32(2) to support the tworadio bands. The first and second antennas 16(1), 16(2) could beprovided as antenna elements as part of a single antenna that has dualradio band capability of the RU 12′. Alternatively, the first and secondantennas 16(1), 16(2) could be provided as separate antennas to providethe dual radio band capability of the RU 12′.

Just as provided in the distributed antenna system 10 in FIG. 1, thecircuitry of the distributed antenna system 10′ can be included in aRFIC chips. As one example, the same RFIC chips illustrated in thedistributed antenna system 10 in FIG. 1 can be provided in thedistributed antenna system 10′ in FIG. 4. Two RFIC chips are provided inthe distributed antenna system 10′ in FIG. 4 for each RFIC chip in thedistributed antenna system 10 in FIG. 1, with the notations (1) and (2)to signify RFIC chips supporting circuitry for the first radio band orthe second radio band, respectively.

Also note that although in this example in FIG. 4, the DCs 34 isprovided in the downlink communications path to downconvert the downlinkRF communications signals and the UCs 40 are provided in the uplinkcommunications path to upconvert the uplink RF communications signals,the opposite configuration could be provided. That is, the UCs 40 couldbe provided in the downlink communications path to upconvert thedownlink RF communication signals, and the DCs 34 be provided in theuplink communications path to downconvert the uplink RF communicationssignals. These frequency conversion circuitries can be also referred togenerally as first, second, third, etc. frequency conversioncircuitries.

FIG. 5 is a schematic diagram of an exemplary single band,multiple-input/multiple-output (MIMO) distributed RF communicationssystem 10″ employing RFIC chips for providing RF communications servicesto the RUs 12′. The distributed antenna system 10″ includes commonelements, signified by common element numbers, with the distributedantenna system 10′ in FIG. 4, and thus will not be re-described. The twoantennas 16(1), 16(2) in the RU 12′ are configured to provide downlinkRF communications signals 30D(1), 30D(2) and receive uplink RFcommunications signals 30U(1), 30U(2) of the same RF frequency tosupport MIMO RF communications services. The notations (1) and (2) inthis example signify 2×2 MIMO RF communications signal paths, but otherhigher MIMO communications schemes (e.g., 4×4) can also be provided withappropriate scaling.

The communications medium 26′ is configured to either provide separatecommunications paths for the downlink RF communications signals 24U(1),24U(2) providing multiple downlink communications paths, and the uplinkRF communications signals 24U(1), 24U(2) providing multiple uplinkcommunications paths. Alternatively, common paths in the communicationsmedium 26′ could be employed for downlink RF communications signals24U(1), 24U(2) and the uplink RF communications signals 24U(1), 24U(2).DCs 34(1), 34(2) could be configured to frequency shift the downlink RFcommunication signals 24D(1), 24D(2) to different IFs to avoidinterference between the multiple downlink communications paths.Similarly, the DCs 38(1), 38(2) could be configured to frequency shiftthe uplink RF communication signals 30D(1), 30D(2) to different IFs toavoid interference between the multiple uplink communications paths.

The DC 34, UC 40, and synthesizer circuitry 42 in the central unit 14 inFIGS. 4 and 5 can be provided in differing configurations andorganizations in one or more RFIC chips. For example, FIG. 6 is aschematic diagram of exemplary RFIC chip architectures that can beprovided in the central unit 14 for supporting RF communications to RUs12 in a distributed antenna system, including the distributed antennasystem described above. With reference to FIG. 6, in one example, the DC34, UC 40, and synthesizer circuitry 42 can be provided in a single RFICchip 120. In this regard, the DC 34 is comprised of a downlink interface(DL IF) 122 that receives the downlink electrical communication signals20D. The DL IF 122 provides the downlink electrical communicationsignals 20D to a downconversion mixer 124. The downconversion mixer 124also receives a local oscillator signal 126 from a local oscillator 128in the synthesizer circuitry 42. The local oscillator signal 126 servesas a reference to the downconversion mixer 124 for downconverting thefrequency of the downlink electrical RF communications signals 20D todownlink electrical RF signals 130D at a different intermediatefrequency than the frequency of the downlink electrical RF communicationsignals 20D. The downlink electrical RF communication signals 24D areprovided to a downlink RF circuit 132 to provide the downlink RF signals24D to the RF communications interface 62 as shown in FIGS. 4 and 5.

With continuing reference to FIG. 6, the uplink RF communicationssignals 24U are received by an uplink RF circuit 134 in the RFIC chip120. The uplink RF communications signals 24U are provided from theuplink RF circuit 134 to an upconversion mixer 136 to be combined with alocal oscillator signal 138 from a local oscillator 140. The localoscillator signal 138 is provided such that its frequency is mixed withthe downlink RF communications signals 24U to upconvert the frequencyfrom an intermediate frequency to the RF frequency to be provided as theuplink electrical RF communications signals 20U. The uplink electricalRF communications signals 20U are provided to an uplink interface 142which then provides the uplink electrical RF communications signals 20Uto the radio interface 54.

With continuing reference to FIG. 6, the synthesizer circuit, inaddition to containing the local oscillators 128, 140 also includeseveral other exemplary components. For example, the synthesizercircuitry 42 contains a local oscillator interface circuit 144 that isconfigured for generating and decoding management signals 146. Forexample these management signals 146 may be amplitude shift key (ASK)management signals. The management signals 146 may be provided tocontrol the local oscillators 128, 140 including when the localoscillators 128, 140 are activated and deactivated. The managementsignals 146 may also contain other information unrelated to the localoscillators 128, 140 for providing other information to the central unit14 and/or its components. The synthesizer circuitry 42 in FIG. 6 alsocontains a phase lock loop (PLL) circuit 148 that is configured tomeasure the frequency ratio between a local lock source signal 150 andthe management signal 146 and update the local oscillators 128, 140 toprovide accurate frequency and clean local oscillator signals 126, 138.The synthesizer circuitry 42 may also contain a micro-controller unit152 that is configured to receive controller signals 154 and to providecontroller output signals 156 for reporting, monitoring, and orcontrolling the components in the RFIC chip 120 as desired.

Note that although the DC 34, the UC 40, the synthesizer circuitry 42are provided in the same RFIC chip 120 in FIG. 6, other organizationswith regard to RFIC chip partitioning are possible. For example, the DC34, the UC 40, and the synthesizer circuitry 42 could be provided inseparate RF chips as shown by the dashed lines in FIG. 6. As anotherexample, the DC 34 and the UC 40 could be provided in one RFIC chip andthe synthesizer circuitry 42 provided in a separate RFIC chip. In thatconfiguration, the local oscillators 128, 140 may be included in thesame RFIC chip that includes the DC 34 and UC 40. Alternatively, thelocal oscillator 128 and local oscillator 140 may be included in thesame RFIC chip that includes the local oscillator interface 144, the PLLcircuit 148, and the micro-controller unit 152.

Other architectures of dividing the DL 34, the UC 40, and thesynthesizer circuitry 42 components into more than one RFIC chip arealso possible. For example, FIG. 7 illustrates these components withalternative configurations of splitting these components betweendifferent RFIC chips. For example, the downlink interface 122 and theuplink interface 142 may be provided together in a RFIC chip 158. Theother components as illustrated in FIG. 7 may be provided in anotherRFIC chip 160. Alternatively, the local oscillators 128, 140 could beincluded in the same RFIC chip as the downconversion and upconversionmixers 124, 136, and the downlink RF circuit 132 and the uplink RFcircuit 134. The local oscillator interface 144, the PLL circuit 148,and the micro-controller unit 152 could be provided in a third RFIC chip162. In yet another configuration, the local oscillators 128, 140 couldbe included in the same RFIC chip 162 and not in the RFIC chip 160. Inyet another configuration, four RFIC chips could be provided. RFIC chip158 is illustrated in FIG. 7 could be provided the local oscillators128, 140 could be provided in a fourth RFIC chip 164, wherein the localoscillator interface 144, the PLL circuit 148, and the micro-controllerunit 152 are provided in a third RFIC chip 162. The RFIC chip 160 couldinclude the downconversion and upconversion mixers 124, 136, thedownlink RF circuit 132, and the uplink RF circuit 134. In yet anotherconfiguration, the downlink interface 122, the uplink interface 142, andthe local oscillators 128, 140 could be provided in a single RFIC chip.The local oscillator interface 144, the PLL circuit 148, and themicro-controller unit 152 would be included in a second RFIC chip, andthe downconversion and upconversion mixers 124, 136, the downlink RFcircuit 132 and the uplink RF circuit 134 included in a third RFIC chip.FIG. 8 illustrates additional configurations of providing the componentsof the DC 34, the UC 40, and the synthesizer circuitry 42 into differentRFIC chips. For example, as illustrated in FIG. 8, the downlinkinterface 122 and uplink interface 142 could be included in the RFICchip 158. The local oscillators 128, 140, and the local oscillatorinterface 144, the PLL circuit 148, and the micro-controller unit 152could be included in a second RFIC chip 166. The downconversion mixer124 and the upconversion mixer 136 could be included in a third RFICchip 168. The downlink RF circuit 132 and the uplink RF circuit 134could be included in the RFIC chip 168 or could be included in their ownfourth RFIC chip 170.

The components provided in the remote units 12 can also be organized indifferent configurations and provided among one or more RFIC chips. FIG.9 illustrates one embodiment of UC 36, DC 38, and synthesizer circuitry44 organized among one or more RFIC chips. In the example of FIG. 9, thesynthesizer circuitry 44(1), 44(2) is provided in a single RFIC chip172. In this embodiment, the synthesizer circuitry 44(1), 44(2) supportstwo different radio bands for a RU 12. In this regard, the synthesizercircuitry 44(1), 44(2) includes two upconversion local oscillators174(1), 174(2) and two downconversion local oscillators 176(1), 176(2).The upconversion local oscillators 174(1), 174(2) provide localoscillation signals 182(1), 182(2) to upconversion mixer 186 andupconversion mixer 188, respectively. The upconvert local oscillatorsignals 182(1), 182(2) are provided to upconversion mixers 184(1),184(2) to provide a reference signal for frequency upconversion ofdownlink electrical RF communications signals 24D(1), 24D(2). Thedownlink electrical RF communications signals 24D(1), 24D(2) arereceived by a downlink interfaces 186(1), 186(2) for the RU 12 tosupport two radio bands. The RFIC chip 172 also contains a localoscillator interface 188 configured to receive source signal 190 forproviding control signals to the upconversion local oscillators anddownconversion local oscillators 174(1)-174(2), 176(1)-176(2). A PLLcircuit 192 is also provided that is configured to receive controlsignal 194 to phase lock loop the local oscillators 174(1)-174(2),176(1)-176(2) to source signal 190. A microcontrol unit 196 is alsoprovided that is configured to exchange management signals 198 forproviding control of the synthesizer circuitry 44(1), 44(2).

With continuing reference to FIG. 9, the downconversion localoscillators 176(1), 176(2) are configured to generate downconversionoscillation signals 189(1), 189(2) to be provided to downconversionmixers 200(1), 200(2), respectively. The UCs 36(1), 36(2) and the DCs38(1), 38(2) are provided in a second RFIC chip 202. For the UCs 36(1),36(2), the downlink electrical RF communications signals 24D(1), 24D(2)are mixed by the upconversion mixers 184(1), 184(2) to be upconvertedback to RF communications signals at the same frequency as the downlinkelectrical RF communications signals 20D(1), 20D(2) to provide thedownlink RF communications signals 30D(1), 30D(2). The downlink RFcommunications signals 30D(1), 30D(2) are received by downlink RFcircuits. The downlink RF circuits 204(1), 204(2) receive the downlinkRF communications signals 30D(1), 30D(2) and provide these signals tothe antenna interface 32 (see FIGS. 4 and 5).

With continuing reference to FIG. 9, the DCs 38(1), 38(2) are alsoprovided in the RF communication chip 202 containing the UCs 36(1),36(2). Uplink RF circuits 206(1), 206(2) are provided to receive theuplink RF communication signals 30U(1), 30U(2) from the antennainterface 32. The uplink RF circuits 206(1), 206(2) provide the uplinkRF communications signals 30U(1), 30U(2) to the downconversion mixers200(1), 200(2) to downconvert the frequency of these signals beforebeing provided to the uplink interfaces 208(1), 208(2).

Other configurations and organizations of the UC 36, DC 38, andsynthesizer circuitry 44 in the RU 12 can be provided. For example, withreference back to FIG. 9, the local oscillators 174(1), 174(2), 176(1),176(2) can be provided in a different RFIC chip than the localoscillator interface 188, PLL circuit 192, and micro-controller unit196. As another example with reference to FIG. 10, a single radio bandconfiguration is shown for the UC 36 and DC 38. Instead of the localoscillators 174, 176 being included in the same RFIC chip 210 asincluding the local oscillator interface 188, PLL circuit 192, andmicro-controller unit 196, the local oscillators 174, 176 are includedin a RFIC chip 212 that includes the UC 36 and the DC 38.

In FIG. 11, an alternative configuration is provided for the UCs 36(1),36(2) and the DCs 38(1), 38(2). In this embodiment, the UCs 36(1), 36(2)are provided in a separate RFIC chip 214, and the DCs 38(1), 38(2) areprovided in a separate RFIC chip 216. The synthesizer circuitry 44(1),44(2) supporting both radio bands supporting providing both oscillationsignals 182(1), 182(2), 189(1), 189(2) are provided in the RFIC chip 172just as provided in the example of the RU in FIG. 9.

FIG. 12 illustrates yet another variation of organization of the UC 36,DC 38, and synthesizer circuitry 44 among different RFIC chips. In thisregard, the UC 36(1), 36(2) and the DC 38(1), 38(2) with the downlinkand uplink interfaces 186(1), 186(2), 208(1), 208(2) not included areprovided in a first RFIC chip 220. A second RFIC chip 222 contains thesynthesizer circuitry 44(1), 44(2) and the downlink and uplinkinterfaces 186(1), 186(2), 208(1), 208(2). Alternatively, thesynthesizer circuitry 44(1), 44(2) could be provided in a third RFICchip 224 that is separate from the RFIC chip 222, if desired.

FIG. 13 illustrates yet another alternative embodiment of a RFIC chipconfiguration for a remote unit (RU) 12, for a single radio band. Inthis embodiment, the UC 36, the DC 38, and the synthesizer circuitry 44for a single band are all included in the same RFIC chip 226. In yetanother embodiment as illustrated in FIG. 14, the UC 36, the DC 38, andthe synthesizer circuitry 44 supporting a single radio band are providedin separate RFIC chips 228, 230, and 232, respectively.

The above examples of distributed antenna systems are not limited tofrequency shifting of communications signals or to a particularfrequency shifting scheme. The downlink communication signals could befrequency upconverted or downconverted. The uplink signals could befrequency upconverted or downconverted.

FIG. 15 is a schematic diagram of the exemplary distributed antennasystem 10 in FIG. 1, but employing a switching matrix 240 in thecommunications interface 27 for providing multiple switched RFcommunications services and/or digital data services to any of aplurality of RUs 12(1)-12(Q), where Q signifies any number of RUs 12.The switching matrix 240 is disposed in the communications interfaceRFIC chip 62 in this embodiment. The RUs 12(1)-12(Q) may be AP, like theAPs 102 in the distributed antenna system 80 in FIG. 2, that are capableof supporting RF communication services and digital data services. Withcontinuing reference to FIG. 15, common element numbers betweencomponents in the distributed antenna system 10′ in FIG. 4 and thedistributed antenna system 10 in FIG. 1 denote common elements andfunctionality, and thus will not be re-described. The notations (1)-(4)signify common elements, but four of the elements provided, to supportfour transmissions from the radio interface 18 of up to four RFcommunications switched to any of the RUs 12(1)-12(R) desired.

The distributed antenna system 10 in FIG. 15 shows RUs 12(1)-12(Q)supporting both RF communications services and digital data services.The switching matrix 240 can be configured through the matrix controlsignals 242 to provide (i.e., switch) any combination of the RFcommunication services from the radio interfaces 18(1)-18(R) to the RUs12(1)-12(Q). As a non-limiting example, one radio interface 18(R)provides RF communication services over downlink RF communicationssignals 20D(R) that are not frequency shifted. A service combiner 244 isprovided to combine any of the RF communications services switched bythe switching matrix 240 (i.e., downlink RF communications signals24D(1)-24D(3) and 20D(R)) with downlink digital data signals96D(1)-96D(S) to be provided over the communications medium 26 to theRUs 12(1)-12(Q) according to the configured switching in the switchingmatrix. In this manner, the matrix control signals 242 can control whichRUs 12(1)-12(Q) receive which RF communications services from the radiointerfaces 18(1)-18(R).

FIG. 16 is a schematic diagram of the switching matrix 120 illustratingmore detail regarding the switching provided therein. FIG. 16 onlyillustrates the switching circuitry in the switching matrix 240 fordownlink RF communications services, but the same principles can applyfor uplink RF communications services as well. As previously discussed,the switching matrix can be employed in communications interface RFICchip 62 (FIG. 15) for switching RF communications services to the RUs12(1)-12(Q). As illustrated in FIG. 16, the switching matrix 240includes a matrix control decoder 244 that receives the matrix controlsignals 242 to provide decoded switching signals 246. The decodedswitching signals 246 control the matrix of switches 248. The matrix ofswitches is designed to switch any combination of the downlink RFcommunications signals 24D(1)-24D(3), 20D(R) to any RU 12(1)-12(Q). Inthis example, the switching matrix 240 is two-dimensional matrix of R×Qsize, where R is the number of downlink RF communication services, and Qis the number of RUs 12.

The distributed antenna systems that can employ the RFIC chip(s)disclosed herein can employ other communications mediums other thanelectrical conductors. For example, the communications mediums couldalso include wireless transmission and reception and/or optical fiber.FIG. 17 is a schematic diagram of an embodiment of another distributedantenna system that may employ an RFIC chip(s). In this embodiment, thedistributed antenna system is an optical fiber-based distributed antennasystem 260. The optical fiber-based distributed antenna system 260 isconfigured to create one or more antenna coverage areas for establishingcommunications with wireless client devices located in the RF range ofthe antenna coverage areas. The system 260 provides RF communicationservices (e.g., cellular services). In this embodiment, the opticalfiber-based distributed antenna system 260 includes central unit 262,one or more RUs 264, and an optical fiber 266 that optically couples thecentral unit 262 to the RU 264. Also by employing the switching matrix240, it may be possible to identify which RU 264 is communicating withor closest to a subscriber. For example, see U.S. PCT Application No.US11/29895 filed on Mar. 25, 2011 and entitled “Localization Services inOptical Fiber-Based Distributed Communication Components and Systems,and Related Methods,” and U.S. PCT Application No. US11/49122 filed onAug. 25, 2011 entitled “Localization of Wireless Handheld Devices inDistributed Antenna Systems by Signal Delay,” both of which areincorporated by reference.

The RU 264 is a type of remote communications unit. In general, a remotecommunications unit can support either wireless communications, wiredcommunications, or both. The RU 264 can support wireless communicationsand may also support wired communications. The central unit 262 isconfigured to receive communications over downlink electrical RF signals268D from a source or sources, such as a network or carrier as examples,and provide such communications to the RU 264. The central unit 262 isalso configured to return communications received from the RU 264, viauplink electrical RF signals 268U, back to the source(s). In this regardin this embodiment, the optical fiber 266 includes at least one downlinkoptical fiber 266D to carry signals communicated from the central unit262 to the RU 264 and at least one uplink optical fiber 266U to carrysignals communicated from the RU 264 back to the central unit 262. Thedownlink optical fiber 266D and uplink optical fiber 266U could beprovided as the same fiber employing wave division multiplexing (WDM) asan example.

One downlink optical fiber 266D and one uplink optical fiber 266U couldbe provided to support multiple channels each using wave-divisionmultiplexing (WDM), as discussed in U.S. patent application Ser. No.12/892,424 entitled “Providing Digital Data Services in OpticalFiber-based Distributed Radio Frequency (RF) Communications Systems, AndRelated Components and Methods,” incorporated herein by reference in itsentirety. Other options for WDM and frequency-division multiplexing(FDM) are disclosed in U.S. patent application Ser. No. 12/892,424, anyof which can be employed in any of the embodiments disclosed herein.Further, U.S. patent application Ser. No. 12/892,424 also disclosesdistributed digital data communications signals in a distributed antennasystem which may also be distributed in the optical fiber-baseddistributed antenna system 260 either in conjunction with RFcommunications signals or not.

The optical fiber-based distributed antenna system 260 has an antennacoverage area 270 that can be disposed about the RU 264. The antennacoverage area 270 of the RU 264 forms an RF coverage area 271. Thecentral unit 262 is adapted to perform or to facilitate any one of anumber of Radio-over-Fiber (RoF) applications, such as RF identification(RFID), wireless local-area network (WLAN) communication, or cellularphone service. Shown within the antenna coverage area 270 is a wirelessclient device 274 in the form of a mobile device as an example, whichmay be a cellular telephone as an example. The wireless client device274 can be any device that is capable of receiving RF communicationssignals. The wireless client device 274 includes an antenna 276 (e.g., awireless card) adapted to receive and/or send electromagnetic RFsignals. As previously discussed above, it may be typical for theantenna 276 of the wireless client device 274 to be orientedperpendicular or substantially perpendicular to the ground during usesuch that the antenna 276 has a vertical polarization to the ground.

With continuing reference to FIG. 17, to communicate the electrical RFsignals over the downlink optical fiber 266D to the RU 264, to in turnbe communicated to the wireless client device 274 in the antennacoverage area 270 formed by the RU 264, the central unit 262 includes aradio interface in the form of an electrical-to-optical (E/O) converter278. The E/O converter 278 converts the downlink electrical RF signals268D to downlink optical RF signals 272D to be communicated over thedownlink optical fiber 266D. The RU 264 includes anoptical-to-electrical (O/E) converter 280 to convert received downlinkoptical RF signals 272D back to electrical RF signals to be communicatedwirelessly through a selected antenna 282 of the RU 264 to wirelessclient devices 274 located in the antenna coverage area 270. Theselected antenna 282 used in communication to the wireless client device274 may be selected according to an automatic antenna selectionarrangement, including the distributed antenna system 10 disclosedherein that is included in the RU 264.

Similarly, the selected antenna 282 is also configured to receivewireless RF communications from wireless client devices 274 in theantenna coverage area 270. In this regard, the selected antenna 282receives wireless RF communications from wireless client devices 274 andcommunicates electrical RF signals representing the wireless RFcommunications to an E/O converter 284 in the RU 264. The E/O converter284 converts the electrical RF signals into uplink optical RF signals272U to be communicated over the uplink optical fiber 266U. An O/Econverter 286 provided in the central unit 262 converts the uplinkoptical RF signals 272U into uplink electrical RF signals, which canthen be communicated as uplink electrical RF signals 268U back to anetwork or other source. The central unit 262 in this embodiment is notable to distinguish the location of the wireless client devices 274 inthis embodiment. The wireless client device 274 could be in the range ofany antenna coverage area 270 formed by an RU 264.

In a typical cellular system, for example, a plurality of BTSs aredeployed at a plurality of remote locations to provide wirelesstelephone coverage. Each BTS serves a corresponding cell and when amobile wireless client device enters the cell, the BTS communicates withthe mobile client device. Each BTS can include at least one radiotransceiver for enabling communication with one or more subscriber unitsoperating within the associated cell. As another example, wirelessrepeaters or bi-directional amplifiers could also be used to serve acorresponding cell in lieu of a BTS. Alternatively, radio input could beprovided by a repeater, picocell, or femtocell as other examples.

The optical fiber-based distributed antenna system 260 in FIG. 17 may beconfigured to support distribution of both radio-frequency (RF)communication services and digital data services. The RF communicationservices and digital data services may be provided over optical fiber towireless client devices 274 through the RUs 264. For example,non-limiting examples of digital data services include WLAN, WiMax,WiFi, Digital Subscriber Line (DSL), and LTE, etc. Digital data servicescan also be provided over optical fiber separate from optical fiber266D, 266U providing RF communication services. Alternatively, digitaldata services can be provided over common optical fiber 266D, 266U withRF communication services. For example, digital data services can beprovided over common optical fiber 266D, 266U with RF communicationservices at different wavelengths through WDM and/or at differentfrequencies through FDM. Power provided in the distributed antennasystem to provide power to remote units can also be accessed to providepower to digital data service components.

Any of the distributed antenna system components disclosed herein caninclude a computer system. In this regard, FIG. 18 is a schematicdiagram representation of additional detail regarding an exemplary formof an exemplary computer system 290 that is adapted to executeinstructions from an exemplary computer-readable medium to perform powermanagement functions and can be included in a distributed antenna systemcomponent(s). In this regard, the computer system 290 includes a set ofinstructions for causing the distributed antenna system component(s) toprovided its designed functionality. The distributed antenna systemcomponent(s) may be connected (e.g., networked) to other machines in aLAN, an intranet, an extranet, or the Internet. The distributed antennasystem component(s) may operate in a client-server network environment,or as a peer machine in a peer-to-peer (or distributed) networkenvironment. While only a single device is illustrated, the term“device” shall also be taken to include any collection of devices thatindividually or jointly execute a set (or multiple sets) of instructionsto perform any one or more of the methodologies discussed herein. Thedistributed antenna system component(s) may be a circuit or circuitsincluded in an electronic board card, such as a printed circuit board(PCB) as an example, a server, a personal computer, a desktop computer,a laptop computer, a personal digital assistant (PDA), a computing pad,a mobile device, or any other device, and may represent, for example, aserver or a user's computer. The exemplary computer system 290 in thisembodiment includes a processing device or processor 294, a main memory296 (e.g., read-only memory (ROM), flash memory, dynamic random accessmemory (DRAM) such as synchronous DRAM (SDRAM), etc.), and a staticmemory 298 (e.g., flash memory, static random access memory (SRAM),etc.), which may communicate with each other via the data bus 300.Alternatively, the processing device 294 may be connected to the mainmemory 296 and/or static memory 298 directly or via some otherconnectivity means. The processing device 294 may be a controller, andthe main memory 296 or static memory 298 may be any type of memory, eachof which can be included in the central unit 262.

The processing device 294 represents one or more general-purposeprocessing devices such as a microprocessor, central processing unit, orthe like. More particularly, the processing device 294 may be a complexinstruction set computing (CISC) microprocessor, a reduced instructionset computing (RISC) microprocessor, a very long instruction word (VLIW)microprocessor, a processor implementing other instruction sets, orprocessors implementing a combination of instruction sets. Theprocessing device 294 is configured to execute processing logic ininstructions 301 for performing the operations and steps discussedherein.

The computer system 290 may further include a network interface device302. The computer system 290 also may or may not include an input 304 toreceive input and selections to be communicated to the computer system290 when executing instructions. The computer system 290 also may or maynot include an output 306, including but not limited to a display, avideo display unit (e.g., a liquid crystal display (LCD) or a cathoderay tube (CRT)), an alphanumeric input device (e.g., a keyboard), and/ora cursor control device (e.g., a mouse).

The computer system 290 may or may not include a data storage devicethat includes instructions 308 stored in a computer-readable medium 310.The instructions 308 may also reside, completely or at least partially,within the main memory 296 and/or within the processing device 294during execution thereof by the computer system 290, the main memory 296and the processing device 294 also constituting computer-readablemedium. The instructions 301 may further be transmitted or received overa network 312 via the network interface device 302.

While the computer-readable medium 310 is shown in an exemplaryembodiment to be a single medium, the term “computer-readable medium”should be taken to include a single medium or multiple media (e.g., acentralized or distributed database, and/or associated caches andservers) that store the one or more sets of instructions. The term“computer-readable medium” shall also be taken to include any mediumthat is capable of storing, encoding or carrying a set of instructionsfor execution by the processing device and that cause the processingdevice to perform any one or more of the methodologies of theembodiments disclosed herein. The term “computer-readable medium” shallaccordingly be taken to include, but not be limited to, solid-statememories, optical and magnetic medium, and carrier wave signals.

The embodiments disclosed herein include various steps. The steps of theembodiments disclosed herein may be performed by hardware components ormay be embodied in machine-executable instructions, which may be used tocause a general-purpose or special-purpose processor programmed with theinstructions to perform the steps. Alternatively, the steps may beperformed by a combination of hardware and software.

The embodiments disclosed herein may be provided as a computer programproduct, or software, that may include a machine-readable medium (orcomputer-readable medium) having stored thereon instructions, which maybe used to program a computer system (or other electronic devices) toperform a process according to the embodiments disclosed herein. Amachine-readable medium includes any mechanism for storing ortransmitting information in a form readable by a machine (e.g., acomputer). For example, a machine-readable medium includes amachine-readable storage medium (e.g., read only memory (“ROM”), randomaccess memory (“RAM”), magnetic disk storage medium, optical storagemedium, flash memory devices, etc.).

The various illustrative logical blocks, modules, and circuits describedin connection with the embodiments disclosed herein may be implementedor performed with a processor, a Digital Signal Processor (DSP), anApplication Specific Integrated Circuit (ASIC), a Field ProgrammableGate Array (FPGA) or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or any combinationthereof designed to perform the functions described herein. A controllermay be a processor. A processor may be a microprocessor, but in thealternative, the processor may be any conventional processor,controller, microcontroller, or state machine. A processor may also beimplemented as a combination of computing devices, e.g., a combinationof a DSP and a microprocessor, a plurality of microprocessors, one ormore microprocessors in conjunction with a DSP core, or any other suchconfiguration.

The embodiments disclosed herein may be embodied in hardware and ininstructions that are stored in hardware, and may reside, for example,in Random Access Memory (RAM), flash memory, Read Only Memory (ROM),Electrically Programmable ROM (EPROM), Electrically ErasableProgrammable ROM (EEPROM), registers, a hard disk, a removable disk, aCD-ROM, or any other form of computer-readable medium known in the art.An exemplary storage medium is coupled to the processor such that theprocessor can read information from, and write information to, thestorage medium. In the alternative, the storage medium may be integralto the processor. The processor and the storage medium may reside in anASIC. The ASIC may reside in a remote station. In the alternative, theprocessor and the storage medium may reside as discrete components in aremote station, base station, or server.

Further, as used herein, it is intended that terms “fiber optic cables”and/or “optical fibers” include all types of single mode and multi-modelight waveguides, including one or more optical fibers that may beupcoated, colored, buffered, ribbonized and/or have other organizing orprotective structure in a cable such as one or more tubes, strengthmembers, jackets or the like. The optical fibers disclosed herein can besingle mode or multi-mode optical fibers. Likewise, other types ofsuitable optical fibers include bend-insensitive optical fibers, or anyother expedient of a medium for transmitting light signals.

Many modifications and other embodiments of the embodiments set forthherein will come to mind to one skilled in the art to which theembodiments pertain having the benefit of the teachings presented in theforegoing descriptions and the associated drawings. It is intended thatthe embodiments cover the modifications and variations of theembodiments provided they come within the scope of the appended claimsand their equivalents. Although specific terms are employed herein, theyare used in a generic and descriptive sense only and not for purposes oflimitation.

We claim:
 1. A central unit for providing communications signals in awireless communications system, comprising: a radio-frequency (RF)communications interface configured to: receive downlink RFcommunication signals at a RF communications frequency for a RFcommunications service; and provide uplink RF communication signals atthe RF communications frequency for the RF communications service; atleast one RF integrated circuit (IC) (RFIC) chip comprising at least oneof: a first frequency conversion circuitry configured to shift afrequency of the downlink RF communication signals to an intermediatefrequency (IF) having a different frequency than the RF communicationsfrequency, to provide downlink IF communications signals; and a secondfrequency conversion circuitry configured to shift the frequency ofuplink IF communication signals to the RF communications frequency toprovide the uplink RF communications signals, wherein the downlink RFcommunication signals are comprised of MIMO downlink RF communicationsignals, the uplink RF communications signals are comprised of MIMOuplink RF communication signals, the downlink IF communications signalsare comprised of MIMO downlink IF communication signals, the uplink IFcommunication signals are comprised of MIMO uplink IF communicationssignals; and the RF communications interface is further configured to:receive second MIMO downlink RF communication signals at the RFcommunications frequency for the RF communications service; and receivesecond MIMO uplink RF communication signals at the RF communicationsfrequency for the RF communications service, the central unit furthercomprising at least one second RFIC chip comprising at least one of: athird frequency conversion circuitry configured to shift the frequencyof the second MIMO downlink RF communication signals to a second IFhaving a different frequency than the RF communications frequency, toprovide second MIMO downlink IF communications signals; and a fourthfrequency conversion circuitry configured to shift the frequency ofsecond MIMO uplink IF communication signals to the RF communicationsfrequency to provide the second MIMO uplink RF communications signals.2. The central unit of claim 1, wherein the IF and the second IF do notoverlap, and the at least one RFIC chip is comprised of a single RFICchip.
 3. The central unit of claim 2, wherein the first frequencyconversion circuitry is comprised of an up conversion frequencyconversion circuitry, the second frequency conversion circuitry iscomprised of a down conversion frequency conversion circuitry.
 4. Thecentral unit of claim 1, wherein the first frequency conversioncircuitry is comprised of an up conversion frequency conversioncircuitry, the second frequency conversion circuitry is comprised of adown conversion frequency conversion circuitry.
 5. A central unit forproviding communications signals in a wireless communications system,comprising: a radio-frequency (RF) communications interface configuredto: receive downlink RF communication signals at a RF communicationsfrequency for a RF communications service; and provide uplink RFcommunication signals at the RF communications frequency for the RFcommunications service; at least one RF integrated circuit (IC) (RFIC)chip comprising at least one of: a first frequency conversion circuitryconfigured to shift a frequency of the downlink RF communication signalsto an intermediate frequency (IF) having a different frequency than theRF communications frequency, to provide downlink IF communicationssignals; and a second frequency conversion circuitry configured to shiftthe frequency of uplink IF communication signals to the RFcommunications frequency to provide the uplink RF communicationssignals; and a communications interface comprising RF communicationscircuitry configured to: provide the downlink IF communications signalsover a communications medium to one or more remote units (RUs); andreceive the uplink IF communication signals provided over acommunications medium from the one or more RUs and provide the uplink IFcommunication signals to the second frequency conversion circuitry,wherein the downlink RF communication signals are comprised of MIMOdownlink RF communication signals, and the uplink RF communicationssignals are comprised of MIMO uplink RF communication signals.
 6. Thecentral unit of claim 5, wherein: the downlink IF communications signalsare comprised of MIMO downlink IF communication signals, and the uplinkIF communication signals are comprised of MIMO uplink IF communicationssignals.
 7. A central unit for providing communications signals in awireless communications system, comprising: a radio-frequency (RF)communications interface configured to: receive downlink RFcommunication signals at a RF communications frequency for a RFcommunications service; and provide uplink RF communication signals atthe RF communications frequency for the RF communications service; atleast one RF integrated circuit (IC) (RFIC) chip comprising at least oneof: a first frequency conversion circuitry configured to shift afrequency of the downlink RF communication signals to an intermediatefrequency (IF) having a different frequency than the RF communicationsfrequency, to provide downlink IF communications signals; and a secondfrequency conversion circuitry configured to shift the frequency ofuplink IF communication signals to the RF communications frequency toprovide the uplink RF communications signals; a second communicationsinterface configured to: receive second downlink RF communicationsignals at a second RF communications frequency for a second RFcommunications service; and receive second uplink RF communicationsignals at the second RF communications frequency for the second RFcommunications service; and at least one second RFIC chip comprising atleast one of: a third frequency conversion circuitry configured to shiftthe frequency of the second downlink RF communication signals to asecond intermediate frequency (IF) having a different frequency than thesecond RF communications frequency, to provide second downlink IFcommunications signals; and a fourth frequency conversion circuitryconfigured to shift the frequency of second uplink IF communicationsignals to the second RF communications frequency to provide the seconduplink RF communications signals, wherein the downlink RF communicationsignals are comprised of MIMO downlink RF communication signals, and theuplink RF communications signals are comprised of MIMO uplink RFcommunication signals.
 8. The central unit of claim 7, furthercomprising a communications interface comprising RF communicationscircuitry configured to: provide the downlink IF communications signalsover a communications medium to one or more remote units (RUs); andreceive the uplink IF communication signals provided over acommunications medium from the one or more RUs and provide the uplink IFcommunication signals to the second frequency conversion circuitry. 9.The central unit of claim 8, wherein: the downlink IF communicationssignals are comprised of MIMO downlink IF communication signals, and theuplink IF communication signals are comprised of MIMO uplink IFcommunications signals.
 10. The central unit of claim 9, wherein the RFcommunications interface is configured to: receive second MIMO downlinkRF communication signals at the RF communications frequency for the RFcommunications service; and receive second MIMO uplink RF communicationsignals at the RF communications frequency for the RF communicationsservice.